Electrolytic tin plating solution for chip components

　Chip components are small surface-mount passive components. Depending on their function, there are different types such as capacitors, resistors, and inductors. They are used as components in a wide range of electronic equipment, from automobiles, home appliances, smartphones, and other communications devices to industrial and healthcare equipment. All chip components have external electrodes, which are nickel-plated and tin-plated for mounting. In recent years, chip components have become smaller and smaller, with 0603 size (0.6 mm × 0.3 mm) and even smaller sizes increasingly used.

Electroplating using barrel equipment is the most common surface treatment for chip components. Nickel and tin plating is applied to electrodes formed with copper or silver paste. To ensure continuity to the terminals of each chip component, a metal ball called a dummy ball is inserted into the barrel at the same time as the component to be plated.

There are various types of chip components, depending on their function, and their materials and shapes. Some of the materials used are susceptible to erosion by acids and alkalis. We offer a wide variety of tin plating solutions to accommodate all types of chip components and to match the plating equipment of our customers.。

Each plating solution in the Melplate SN series has its own characteristics. We will propose the most suitable plating solution according to the material of the parts, uniformity of tin film, whisker resistance in the environment where the parts are used, and production efficiency. We can also provide solutions for high-speed rotary plating equipment as well as barrel plating equipment.