Electroless UBM forming process for aluminum electrodes of semiconductor
Melplate UBM Process
Chemicals
Semiconductor
Plating
EN/EP/IG
Melplate UBM Process
Melplate UBM Process is a process to form UBM (under barrier metal) on Aluminum Electrodes of Semiconductor by electroless nickel / immersion gold plating.◆Features1. Uniform and flat deposits with excellent barrier properties are achieved with minimum damage to electrodes of aluminum or various aluminum alloys.2. Selective electroless depositon even on tiny electrodes3. Completely cyanide free4. Good adhesion and good solder joint properties
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Cross sectinal view of an electrode after UBM process
Melplate UBM process enables to form smooth and uniform electroless plating layers with excellent barrier properties and adhesion. Damage to aluminum electrodes is very slight.
Effective suppression of nickel spike into aluminum electrodes
In conventional process, localized corrosion of aluminum electrodes causes the deep penetration of nickel plating into aluminum electrodes, so-called "nickel spikes" (left). Melplate UBM process suppress this spikes due to optimized zincate treatments. The first zincate treatment is specialized in suppressing localized corrosion of aluminum electrode and the second one contributes to improve the adhesion of electroless nickel plating.
Smooth and uniform electroless deposition
In the conventional process, the surface morphology after zincate treatment may be rough, depending on the material. Melplate UBM process enables smooth deposition of electroless plating on various aluminum alloy electrode materials by forming uniform and dense zinc replacement deposit through optimization of the pretreatment process.