Non-Cyanide type immersion gold plating
Melplate AU-7770
Chemicals
Semiconductor
Plating
Gold
Melplate AU-7770
◆Features
1. Uniform gold film thickness can be obtained
2. Less localized corrosion on nickel deposit
3. Plating rate: 0.04-0.06 μm/10 min
1. Uniform gold film thickness can be obtained
2. Less localized corrosion on nickel deposit
3. Plating rate: 0.04-0.06 μm/10 min
Cyan free
Deposition rate on nickel film
Immersion gold plating is deposited while effectively inhibiting localized corrosion of the underlying nickel film.
Deposition rate on palladium film
It has excellent immersion reactivity, even on palladium films, and the deposition thickness increases linearly with plating time.
Inhibits erosion of underlying nickel film
In the case of EN/EP/IG coating composition, the gold immersion deposition process causes preferential dissolution of nickel (galvanic corrosion) due to the difference in electrode potential between nickel and palladium at the electrode edge, which erodes the nickel coating layer (top photo: reference).
Melplate AU-7770 effectively suppresses galvanic corrosion and allows deposition of immersion gold plating without eroding the underlying nickel layer.
Melplate AU-7770 effectively suppresses galvanic corrosion and allows deposition of immersion gold plating without eroding the underlying nickel layer.