An auto-catalytic electroless palladium plating solution for electroless Ni/Pd/Au process
Melplate Pal-6500
Chemicals
Semiconductor
Plating
Palladium
Melplate Pal-6500
Melplate Pal-6500 is an auto-catalytic electroless palladium plating solution for electroless Ni/Pd/Au process.
◆Features
1. High purity Pd deposit without phosphorus and boron
2. Thick Pd deposit on Ni surface
3. Low localized corrosion on Ni deposit
4. Good solderability and bondability (Ni/Pd/Au plating)
◆Features
1. High purity Pd deposit without phosphorus and boron
2. Thick Pd deposit on Ni surface
3. Low localized corrosion on Ni deposit
4. Good solderability and bondability (Ni/Pd/Au plating)
Surface condition of palladium plating film
Uniform and dense palladium plating is deposited on the underlying nickel film.
Deposition rate on nickel film (bath temperature 60℃)
It has a deposition rate of 0.1 μm/3 min at a bath temperature of 60℃.
Auger spectral analysis of the topmost surface layer (immersion gold plating) after heat treatment(on Cu substrate)
The palladium film deposited by Melplate Pal-6500 effectively suppresses surface diffusion of the underlying metal caused by heat treatment(right figure) and shows good bonding characteristics.