Cyanide-free Immersion Gold Plating Solution for UBM Formation Process

Melplate AU-7621 is a cyanide-free, neutral immersion gold plating solution for Ni/Au electroless UBM formation process on semiconductor wafer electrodes.

◆Features
1. Uniform gold deposit
2. Slight attacks to electroless Nickel deposits
3. Minimized attack on wafer materials due to neutoral bath pH.
4. Excellent bath stability