Mild Etchant for Printed Circuit Boards
※ ENPLATE E-462
Chemicals
PCB
Microetching
Copper
※ ENPLATE E-462
※This product can only be sold to Japan, Malaysia, Indonesia, Thailand, Philippines, Brunei, Vietnam, Singapore, South Korea, Taiwan, Hong Kong, and China under a license agreement.
ENPLATE E-462 is a hydrogen peroxide/sulfuric acid mild etchant for printed circuit boards.
ENPLATE E-462 can be used for pretreatment of copper plating and electroless copper plating.
◆Features
1. Controlled decomposition of hydrogen peroxide resulting from copper and working temperature.
2. Etching rate of copper can be controlled to change working temperature and concentration of hydrogen peroxide.
3. ENPLATE E-462 can be re-used after removing copper. Copper can be recovered as copper sulfate pentahydrate from aged bath.
4. Upper limit of copper dissolution is about 67g/L.(As copper sulfate pentahydrate : 260g/L)
ENPLATE E-462 is a hydrogen peroxide/sulfuric acid mild etchant for printed circuit boards.
ENPLATE E-462 can be used for pretreatment of copper plating and electroless copper plating.
◆Features
1. Controlled decomposition of hydrogen peroxide resulting from copper and working temperature.
2. Etching rate of copper can be controlled to change working temperature and concentration of hydrogen peroxide.
3. ENPLATE E-462 can be re-used after removing copper. Copper can be recovered as copper sulfate pentahydrate from aged bath.
4. Upper limit of copper dissolution is about 67g/L.(As copper sulfate pentahydrate : 260g/L)