Electroless Nickle Plating solution for PCB
Melplate NI-865T
Chemicals
General purpose
Plating
Nickel
Melplate NI-865T
NI-865 is electroless nickel plating solution for PCB
◆Features
1. Does not contain harmful lead as a stabilizer.
2. The initial deposition rate after make-up is 12 to 23 μm/hr.
3. Provide high-gloss deposits.
4. Phosphorous content of electroless nickel deposits is 6 to 8 wt%.
5. Excellent solderability.
◆Features
1. Does not contain harmful lead as a stabilizer.
2. The initial deposition rate after make-up is 12 to 23 μm/hr.
3. Provide high-gloss deposits.
4. Phosphorous content of electroless nickel deposits is 6 to 8 wt%.
5. Excellent solderability.
On sale
Product details
| Products | Melplate NI-865T |
|---|
| Note | ◆EquipmentTank SUS, PP, FRP, PTFE or lined tank with these materials |
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Appearanceat 0MTO
Melplate NI-865T has an excellent initial reaction and can be used not only for general metal materials but also for printed circuit boards.
Appearanceat 3MTO
