Electroless Nickle Plating solution for PCB
Melplate NI-865T
Chemicals
General purpose
Plating
Nickel
Melplate NI-865T
NI-865 is electroless nickel plating solution for PCB
◆Features
1. Does not contain harmful lead as a stabilizer.
2. The initial deposition rate after make-up is 12 to 23 μm/hr.
3. Provide high-gloss deposits.
4. Phosphorous content of electroless nickel deposits is 6 to 8 wt%.
5. Excellent solderability.
◆Features
1. Does not contain harmful lead as a stabilizer.
2. The initial deposition rate after make-up is 12 to 23 μm/hr.
3. Provide high-gloss deposits.
4. Phosphorous content of electroless nickel deposits is 6 to 8 wt%.
5. Excellent solderability.