Melplate NI-869 is a lead- and sodium-free electroless nickel plating solution for UBM process.◆Features1. Lead- and Sodium free2. Excellent initial reactivity even on microelectrodes3. Uniform and quality deposit4. Easy bath controll and continuous operation5. Electroless nickel deposit with 6-8 wt% of phosphorus content.6. 14-16 um/h of deposition rate at 85oC, pH4.6.
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Melplate NI-869
Note
◆EquipmentTank Glass, PP, PTFEHeater Quartz, PTFEAgitationCirculation by using a pump for continuous filtrationFilterPPOthers Installation of exhaust equipment is recommended.
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