Electroless Nickel Plating Solution for Electroless UBM Formation Process
Melplate NI-869
Chemicals
Semiconductor
Plating
Nickel
Melplate NI-869
Melplate NI-869 is a lead- and sodium-free electroless nickel plating solution for UBM process.
◆Features
1. Lead- and Sodium free
2. Excellent initial reactivity even on microelectrodes
3. Uniform and quality deposit
4. Easy bath controll and continuous operation
5. Electroless nickel deposit with 6-8 wt% of phosphorus content.
6. 14-16 um/h of deposition rate at 85oC, pH4.6.
◆Features
1. Lead- and Sodium free
2. Excellent initial reactivity even on microelectrodes
3. Uniform and quality deposit
4. Easy bath controll and continuous operation
5. Electroless nickel deposit with 6-8 wt% of phosphorus content.
6. 14-16 um/h of deposition rate at 85oC, pH4.6.
Lead free