High speed electroess copper plating bath

Melplate CU-5100P is a high-speed electroless copper plating bath for high-build application.

◆Features
1. Reactivity of initial reaction is high, resulting in excellent coverage of copper deposit.
2. Bright and dense copper depsoit is achieved.
3. Deposition rate: 2 μm/20 min.
4. Excellent bath stability without cyanide or other toxic substances.