1st Zincate Solution for Aluminum Electrode on Semiconductor Wafer

Melplate FZ-7350 is a 1st zincate solution for electroless UBM formation process.

◆Features
1. Excess displacement reaction of zinc is effectively suppressed.
Thin and uniform zinc deposit
3. Minimum attack on aluminum electrode surface
4. Excellent adhesion of electroless nickel deposit is acheved using with Melplate FBZ as the second zincate treatment.