Hydrophilizing treatment for electronic parts
Meldip 1200
Chemicals
Electronic
Hydrophilic treatment
Meldip 1200
Meldip 1200 is a hydrophilizing treatment solution for eelctronis parts.
◆Features
1. Floating of small parts like 0603 or smaller in nickel plating baths is supressed by applying hydrophilization treatment with Meldip 1200, resulting in efefctive prevention of skip plating of small electronic parts.
2. If dragged into nickel plating baths, the ingredients of Meldip 1200 have no considerable influence on the properties of nickel deposit and can be removed with activated carbon treatment.
◆Features
1. Floating of small parts like 0603 or smaller in nickel plating baths is supressed by applying hydrophilization treatment with Meldip 1200, resulting in efefctive prevention of skip plating of small electronic parts.
2. If dragged into nickel plating baths, the ingredients of Meldip 1200 have no considerable influence on the properties of nickel deposit and can be removed with activated carbon treatment.
Prevention of floating parts
0402 chip components are put into a nickel plating solution (Watts bath). Whereas 0402 chip components are floating on the surface of the bath in case of no hydrophilizing treatmet using Meldip 1200, there are no floating chip components after hydrophilizing treartmet with Meldip 1200.
Appearance after nickel/tin plating
Surface appearance of chip components electrodes plated with nickel, followed by tin plating (Melplate SN-2680).
Without hydrophilizing treatment, failure deposit of nickel is observed and the following tin plating shows defects. On the other hand, homogheneous plating deposits are achieved by applying hydrophilizing treatment with Meldip 1200.
Without hydrophilizing treatment, failure deposit of nickel is observed and the following tin plating shows defects. On the other hand, homogheneous plating deposits are achieved by applying hydrophilizing treatment with Meldip 1200.