Chemical polishing agent for copper and copper alloys
Melpolish CU-1211(M)
Chemicals
Electronic
Chemical polishing
Cu alloy
Melpolish CU-1211(M)
Melpolish CU-1220 is an acidic chemical polishing agent for copper and copper alloys.◆Features1. Acidic type chemical polishing agent2. Corrosion resistance after nickel/gold plating is improved by applying chemical polishing3. Usage as the pretreatment for solder plating of lead frames is effective to improve adhesion of solder plating4. Low foaming liquid: Applicable to operation using equipment with heavy air entrainment and intense liquid flow
Fluoride free
On sale
Product details
| Products | Melpolish CU-1211(M) |
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| Note | ◆EquipmentTank PP, Heat-resistant PVC, PTFEHeater Quartz, PTFEOthers Install exhaust equipment. |
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Surface appearance after chemical polishing
SEM images of copper material surface after chemical polishing (40℃/15 s) using Melpolish CU-1211(M) and a reference (conventional process). Surface roughness is drastically improved by applying Melpolish CU-1211(M).
Results of salt spray test
Surface after salt spray test (35℃/96 h) of copper pieces plated with nickel/gold after chemical polishing. No corrosion was observed on the piece applying Melpolish CU-1220.
Continuous operation
The oxidizing agent of Melpolosh CU-1211(M) is regeneratable. Once copper concentration reaches steady state, consistent operation is available for long period.