Chemical polishing agent for copper and copper alloys
Melpolish CU-1211(M)
Chemicals
Electronic
Chemical polishing
Cu alloy
Melpolish CU-1211(M)
Melpolish CU-1211(M) is an acidic chemical polishing agent for copper and copper alloys.
◆Features
1. Acid type chemical polishing agent.
2. Improve corrosion resistance after nickel / gold plating.
3. Provide good adhesion by using as pretreatment of solder plating for lead frame.
4. Because of low foaming type, can be used for equipment that entrains air heavily.
◆Features
1. Acid type chemical polishing agent.
2. Improve corrosion resistance after nickel / gold plating.
3. Provide good adhesion by using as pretreatment of solder plating for lead frame.
4. Because of low foaming type, can be used for equipment that entrains air heavily.
Fluoride free
Surface appearance after chemical polishing
SEM images of copper material surface after chemical polishing (40℃/15 s) using Melpolish CU-1211(M) and a reference (conventional process). Surface roughness is drastically improved by applying Melpolish CU-1211(M).
Results of salt spray test
Surface after salt spray test (35℃/96 h) of copper pieces plated with nickel/gold after chemical polishing. No corrosion was observed on the piece applying Melpolish CU-1220.