Electrolytic Acid Copper Plating Additives designed for Any-Layer PCBs
Lucent Copper IVF
Chemicals
PCB
Plating
Copper
Lucent Copper IVF
◆Features
1. Excellent via filling performance with a flat via top
2. Excellent uniform electrodeposition, with less reduction in plating thickness at through hole corner
3. Excellent in-plane uniformity
4. Provide excellent ductility deposit and thermal shock resistance
5. Additive concentration can be analyzed by CVS
1. Excellent via filling performance with a flat via top
2. Excellent uniform electrodeposition, with less reduction in plating thickness at through hole corner
3. Excellent in-plane uniformity
4. Provide excellent ductility deposit and thermal shock resistance
5. Additive concentration can be analyzed by CVS