Lead-Free Bright Electroless Nickel Plating Solution
Melplate NI-871 (ver.2)
Chemicals
General purpose
Plating
Nickel
Melplate NI-871 (ver.2)
◆Features
1. Does not contain lead as stabilizer.
2. The initial deposition rate after make-up is 17 to 22 μm/hr.
3. Phosphorous content of electroless nickel deposits is 6 to 10 wt%.
4. Provide high-gloss deposits.
5. Minimize generation of flock.
1. Does not contain lead as stabilizer.
2. The initial deposition rate after make-up is 17 to 22 μm/hr.
3. Phosphorous content of electroless nickel deposits is 6 to 10 wt%.
4. Provide high-gloss deposits.
5. Minimize generation of flock.
Lead free