Lead Free Bright Electroless Nickel Plating Solution
Melplate NI-2280LF
Chemicals
General purpose
Plating
Nickel
Melplate NI-2280LF
◆Features
1. Does not contain lead as stabilizer.
2. The initial deposition rate after make-up is 14 to18 μm/hr.
3. Phosphorous content of electroless nickel deposits is 8 to11 wt%.
4. Long life by replenishment.
5. Minimize generation of flock.
1. Does not contain lead as stabilizer.
2. The initial deposition rate after make-up is 14 to18 μm/hr.
3. Phosphorous content of electroless nickel deposits is 8 to11 wt%.
4. Long life by replenishment.
5. Minimize generation of flock.
Lead free