Electrolytic copper plating additives for wafer process

Melprime CU-8120 is acid copper plating additives designed for via filling plating of wafer processing.

◆Features
1. Excellent via filling performance at high current density area.
2. Excellent via filling performance with low deposit thickness.
3. Copper deposit shows excellent ductility, malleability and thermal shock resistance.
4. Additives concentration can be analyzed with CVS.