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Acidic Immersion Gold for Electroless Nickel Deposit on Copper Circuit of PWB
Melplate AU-6693
Lyog5aSW6YOo44K144Kk44OI6KGo56S655So44GuQ1NT44GM44GT44GT44Gr5YWl44KK44G+44GZ44CCICovDQoJLmhvZ2Ugew0KDQoJfQ==
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＞ Melplate AU-6693
Chemicals
PCB
Plating
Gold
Melplate AU-6693
Lyog5aSW6YOo44K144Kk44OI6KGo56S655So44GuQ1NT44GM44GT44GT44Gr5YWl44KK44G+44GZ44CCICovDQoJLmhvZ2Ugew0KDQoJfQ==
◆Features
1. Immersion gold bath for thick plating.
2. Excellent wire bonding reliability and solderability.
Lyog5aSW6YOo44K144Kk44OI6KGo56S655So44GuQ1NT44GM44GT44GT44Gr5YWl44KK44G+44GZ44CCICovDQoJLmhvZ2Ugew0KDQoJfQ==
Lyog5aSW6YOo44K144Kk44OI6KGo56S655So44GuQ1NT44GM44GT44GT44Gr5YWl44KK44G+44GZ44CCICovDQoJLmhvZ2Ugew0KDQoJfQ==
Lyog5aSW6YOo44K144Kk44OI6KGo56S655So44GuQ1NT44GM44GT44GT44Gr5YWl44KK44G+44GZ44CCICovDQoJLmhvZ2Ugew0KDQoJfQ==
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