Titanium seed layer etchant for Fan-Out packaging process
LtF E-53
Chemicals
Semiconductor
Stripping
Titanium
LtF E-53
LtF E-53 is a titanium seed layer etchant for Fan-Out packaging process.
◆Features
1. LtF E-53 is a titanium seed layer etchant prepared with hydrogen oxide.
2. Etching rate: 30 nm/min at 25℃, 85 nm/min at 40℃ (immersion treatment)
3. Highly selective etching of titanium: Less corrosion to other materials as copper, aluminum, tin and solder
4. No environmental harmful substances involved
◆Features
1. LtF E-53 is a titanium seed layer etchant prepared with hydrogen oxide.
2. Etching rate: 30 nm/min at 25℃, 85 nm/min at 40℃ (immersion treatment)
3. Highly selective etching of titanium: Less corrosion to other materials as copper, aluminum, tin and solder
4. No environmental harmful substances involved
RDL pattern after Ti etching (L/S=2/2 μm)
Selective etching of titanium achieves copper pattern formation with smooth and flat surface.
Cross section of RDL after Ti etching
No undercut of copper pattern after Ti etching