Palladium Catalyst for Electroless Copper Plating of PWB
※ ENPLATE Activator 444
Chemicals
PCB
Catalyzing
Sn Pd
※ ENPLATE Activator 444
※This product can only be sold to Japan, Malaysia, Indonesia, Thailand, Philippines, Brunei, Vietnam, Singapore, South Korea, Taiwan, Hong Kong, and China under a license agreement.
◆Features
1. Low hydrochloric acid concentration.
2. Can be used in pre-treatment for through-hole plating on both double-sided and multilayer boards.
3. Provide dense and uniform deposit after electroless copper plating.
4. Good coverage and conductivity after electroless copper plating.
5. Stable bath stability.
◆Features
1. Low hydrochloric acid concentration.
2. Can be used in pre-treatment for through-hole plating on both double-sided and multilayer boards.
3. Provide dense and uniform deposit after electroless copper plating.
4. Good coverage and conductivity after electroless copper plating.
5. Stable bath stability.