Catalyst for Electroless Nickel Plating on Copper
※ ENPLATE Activator 440
Chemicals
PCB
Catalyzing
Palladium
※ ENPLATE Activator 440
※This product can only be sold to Japan, Malaysia, Indonesia, Thailand, Philippines, Brunei, Vietnam, Singapore, South Korea, Taiwan, Hong Kong, and China under a license agreement.
ENPLATE Activator 440 is a catalyst for electroless nickel plating on copper. This treatment deposits a thin metallic film on the copper surface, enhancing adhesion for the subsequent electroless nickel plating process.
ENPLATE Activator 440 is a catalyst for electroless nickel plating on copper. This treatment deposits a thin metallic film on the copper surface, enhancing adhesion for the subsequent electroless nickel plating process.