※This product can only be sold to Japan, Malaysia, Indonesia, Thailand, Philippines, Brunei, Vietnam, Singapore, South Korea, Taiwan, Hong Kong, and China under a license agreement.
◆Features
1. ENPLATE PC-455 Conc. is especially effective for deoxidizing and activating copper prior to electroplating and it will not affect most plating resists normally used in through-hole plating.
2. ENPLATE PC-455 Conc. also can be used effectively to remove photoresist binder residues from the copper surfaces of printed circuit boards.