Mild Etchant for Copper Surfaces of PWB
※ ENPLATE AD-485
Chemicals
PCB
Etching
Copper
※ ENPLATE AD-485
※This product can only be sold to Japan, Malaysia, Indonesia, Thailand, Philippines, Brunei, Vietnam, Singapore, South Korea, Taiwan, Hong Kong, and China under a license agreement.
ENPLATE AD-485 can be used wide application such as mild etching of copper to activate before solder plating, electroless copper plating, acid copper plating and after solder stripping.
◆Features
1. ENPLATE AD-485 can be used by mixing with sulfuric acid and water.
2. Waste treatment is easy since it does not containing ammonia.
3. Upper limit of copper dissolution is about 25 g/L.
ENPLATE AD-485 can be used wide application such as mild etching of copper to activate before solder plating, electroless copper plating, acid copper plating and after solder stripping.
◆Features
1. ENPLATE AD-485 can be used by mixing with sulfuric acid and water.
2. Waste treatment is easy since it does not containing ammonia.
3. Upper limit of copper dissolution is about 25 g/L.