Copper Seed Etching Solution for Fan-out Process
LtF E-51
Chemicals
Semiconductor
Stripping
Copper
LtF E-51
LtF E-51 is a copper seed etching solution for Fan-out process.
◆Features
1. Electroless copper deposit is etched quicker than electrolytic copper deposit.
2. Effectively inhibiting undercut and decrease of pattern width.
3. Copper surface after treatment is smooth.
4. More stable than sulfuric acid-hydrogen peroxide etching system because oxidant is NOT self-decomposed.
5. Easy to analyze and control bath components.
6. 300 nm/min of etching rate through spray etching at the optimum operating condition.
◆Features
1. Electroless copper deposit is etched quicker than electrolytic copper deposit.
2. Effectively inhibiting undercut and decrease of pattern width.
3. Copper surface after treatment is smooth.
4. More stable than sulfuric acid-hydrogen peroxide etching system because oxidant is NOT self-decomposed.
5. Easy to analyze and control bath components.
6. 300 nm/min of etching rate through spray etching at the optimum operating condition.