Titanium Etching Solution for Wafer Applications
Melstrip TI-3991
Chemicals
Semiconductor
Etching
Titanium
Melstrip TI-3991
Melstrip TI-3991 is an etching solution for sputtered titanium film on wafers.
◆Features
1. Melstrip TI-3991 is an alkaline type titanium etching solution which is made up with hydrogen peroxide solution.
2. Etching rate on dipping treatment is about 30 nm/min at 25 ℃, and 85 nm/min at 40 ℃.
3. Highly selectivity to titanium etching
4. Low corrosiveness on Cu, Al-Si pads, solder bumps, SiO2, SiN, and polyimide films.
5. Free from environmental toxins.
◆Features
1. Melstrip TI-3991 is an alkaline type titanium etching solution which is made up with hydrogen peroxide solution.
2. Etching rate on dipping treatment is about 30 nm/min at 25 ℃, and 85 nm/min at 40 ℃.
3. Highly selectivity to titanium etching
4. Low corrosiveness on Cu, Al-Si pads, solder bumps, SiO2, SiN, and polyimide films.
5. Free from environmental toxins.
Fluoride free