Additive for dry film resist stripping solution
Melstrip DF Additive
Chemicals
PCB
Stripping
Photoresist
Melstrip DF Additive
◆Features
1. Melstrip DF Additive prevents the displacement deposition of tin on copper surface and suppresses etching failure at the succeeding etching process.
2. Melstrip DF Additive is used as an additive agent for a dry film resist stripper consisting of sodium or potassium hydroxide solution.
3. No influence on resist skin size or stripping time of dry film resists.
4. No need to alter conventional conditions or facilities.
5. PRTR controlled substance free.
1. Melstrip DF Additive prevents the displacement deposition of tin on copper surface and suppresses etching failure at the succeeding etching process.
2. Melstrip DF Additive is used as an additive agent for a dry film resist stripper consisting of sodium or potassium hydroxide solution.
3. No influence on resist skin size or stripping time of dry film resists.
4. No need to alter conventional conditions or facilities.
5. PRTR controlled substance free.