Non-fluoride type accelerator for electroless copper plating process on PCBs

Melplate PA-360 is a fluoride-free, neutral accelerator used in the pretreatment process of electroless copper plating for printed circuit boards.

◆Features
1. Prompt initial deposit reaction is ensured, and dense copper plating deposit is formed with excellent uniformity.
2. Strong adhesion of copper deposit to copper laminate film is achieved.
3. Good coverage on PTHs
4. Long bath life is expected.