Electroless palladium plating
Melplate HPS-3000
Chemicals
PCB
Plating
EN/EP/IG
Melplate HPS-3000
◆Features
1. Thicker pure deposited palladium layer can be obtained on nickel surface.
2. Deposited palladium layer is pure palladium and does not contain phosphorous(P) or boron(B).
3. Hardness of deposited palladium layer is soft and stable after heat treatment.
4. Nickel galvanic corrosion on Au/Pd/Ni process can be suppressed by using these chemicals.
5. Excellent wire bondability and solder joint reliability can be obtained in case of using Au/Pd/Ni layer.
1. Thicker pure deposited palladium layer can be obtained on nickel surface.
2. Deposited palladium layer is pure palladium and does not contain phosphorous(P) or boron(B).
3. Hardness of deposited palladium layer is soft and stable after heat treatment.
4. Nickel galvanic corrosion on Au/Pd/Ni process can be suppressed by using these chemicals.
5. Excellent wire bondability and solder joint reliability can be obtained in case of using Au/Pd/Ni layer.