Tarnish inhibitor for copper & copper alloy
Meldip CU-5600
Chemicals
PCB
Anti tarnish
Cu alloy
Meldip CU-5600
◆Features
1. The coating film formed with Meldip CU-5600 prevents tarnish on copper & copper alloy surface.
2. The coating film is removed with alkaline cleaner (soak or electrolytic).
The coating film does not affect soldering.
Therefore, Meldip CU-5600 is ideal for anti-tarnish of PWB production process.
3. Meldip CU-5600 is a neutral liquid and free from low-boiling solvents like methanol.
1. The coating film formed with Meldip CU-5600 prevents tarnish on copper & copper alloy surface.
2. The coating film is removed with alkaline cleaner (soak or electrolytic).
The coating film does not affect soldering.
Therefore, Meldip CU-5600 is ideal for anti-tarnish of PWB production process.
3. Meldip CU-5600 is a neutral liquid and free from low-boiling solvents like methanol.