Copper seed etchant for semi-additive process (SAP)
Melstrip SE-300
Chemicals
PCB
Etching
Copper
Melstrip SE-300
Melstrip SE-300 is a copper seed etchant specially designed for semi-additive process. Melstrip SE-300 inhibits undercut and decrease of pattern width effectively and forms superior pattern shape.◆Features1. Melstrip SE-300 etches electroless copper deposit more preferentially than electrytic copper deposit: High selectivety to elecroless seed layer etching.2. Preferance etching for elecroless copper doposit contirubutes suppression of undercut of elecrolytic copper patterns, leading to fine pattern formation.3. Flat and smooth copper surface is achieved after seed layer etching.4. The oxidant used in Melstrip SE-300 is not self-dicomposed: The working solution is much stabler than conventional sulfuric acid-hydrogen peroxide type etchant.5. Easy bath control based on analysis of bath components.
On sale
Product details
| Products | Melstrip SE-300 |
|---|
| Note | ◆EquipmentTank PP, PTFEHeater Quartz, titanium, PTFEVentilation Exhaust ventilation is required.◆Handling precautions・The working solution contains an oxidant. Avoid to contact with reducing agents or burnables. |
|---|
Fine pattern after seed layer etching
When copper is in contact with more noble metals, excess disolution of copper caused by electrochemical reaction so-called "galvanic corrosion", is observed during copper seed layer etching. Melstrip SE-300 is effective to suppress the galvanic corrosion with high selectivity to copper etching.
Cross section of copper pattern after seed layer etching
Undercut of copper coductive pattern leads to reduction of circuits reliability. Melstrip SE-300 brings the suppression of undercut compared with a conventional sulfuric acid-hydrogen peroxide type copper etchant and contributes to reliable fine pattern formation.
Surface of copper pattern after seed layer etching
Reduction of transmission loss is the key technology for the next-generation communication standard like 5G. For this, flat copper conductive surface on flat dielectric substrates is high required. Melstrip SE-300 is preferable to achieve flat copper surface after etching compared with a conventional sulfuric acid-hydrogen peroxide type copper etchant.