Copper seed etchant suppressing galvanic corrosion for PCB
Melstrip SE-100
Chemicals
PCB
Etching
Copper
Melstrip SE-100
Melstrip SE-100 is a copper seed layer etchant for PCB manufacturing. The galvanic corrosion caused by dissimilar metals connection during etching process is effectively suppressed.
◆Features
1. The working sokution is week alkaline liquid.
2. The galvanic corrosion caused by dissimilar metal connection is effectively suppressed.
3. Suitable to fine pattern formation due to high selectivity to copper etching without low damage to other metals as tin, nickel.
4. Halogen free: Stainless steel is available for equipment.
◆Features
1. The working sokution is week alkaline liquid.
2. The galvanic corrosion caused by dissimilar metal connection is effectively suppressed.
3. Suitable to fine pattern formation due to high selectivity to copper etching without low damage to other metals as tin, nickel.
4. Halogen free: Stainless steel is available for equipment.
Suppression of the galvanic corrosion
When copper is in contact with more noble metals, excess disolution of copper caused by electrochemical reaction so-called "galvanic corrosion", is observed during copper seed layer etching. Melstrip SE-100 is effective to suppress the galvanic corrosion with high selectivity to copper etching.
Relation between etching time and etched thickness
Etched copper thickness increases proportional to etching time.