Palladium Catalyst on Copper Substrate for Electroless Nickel.
Melplate Activator 354
Chemicals
PCB
Catalyzing
Palladium
Melplate Activator 354
Melplate Activator 350 is a palladium catalytic process to activate copper substrates selectively for electroless nickel plating.
◆Features
1. Possible to catalyze within a relatively short time.
2. Especially effective for PWB application because out-growth of nickel deposit and skip plating are effectively suppressed.
◆Features
1. Possible to catalyze within a relatively short time.
2. Especially effective for PWB application because out-growth of nickel deposit and skip plating are effectively suppressed.
On sale
Product details
| Products | Melplate Activator 354 |
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| Note | ◆Equipment Tank PE, PP or tanks coated with these materials.Heater Quartz or PTFE. DO NOT use steal heaterAir agitation and continuous filtration is recommended. |
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