Palladium Catalyst on Copper Substrate for Electroless Nickel.
Melplate Activator 354
Chemicals
PCB
Catalyzing
Palladium
Melplate Activator 354
Melplate Activator 350 is a palladium catalytic process to activate copper substrates selectively for electroless nickel plating.
◆Features
1. Possible to catalyze within a relatively short time.
2. Especially effective for PWB application because out-growth of nickel deposit and skip plating are effectively suppressed.
◆Features
1. Possible to catalyze within a relatively short time.
2. Especially effective for PWB application because out-growth of nickel deposit and skip plating are effectively suppressed.