电子零部件用电镀锡溶液

Melplate SN-2700

TOP ＞ Melplate SN-2700
Chemicals
Electronic
Plating
Tin

Melplate SN-2700

Melplate SN-2700 是一种弱酸性电解镀锡液，适用于电子零件。

◆特点
1. 焊接性良好
2. 特别适用于电容、电阻和电感的镀锡工艺
3. 可在较宽的电流密度范围内使用（0.05A/dm²–0.3A/dm²）
4. 不会生成四价锡（Sn(IV)）沉淀物
5. 可抑制产品耦合与介质聚集

Chip compornents

Chip compornents
Melplate SN-2700 forms excellent tin deposits, which is necessary to assemble of chip components to PCB.

Assembled MLCC on PCB

Assembled MLCC on PCB
Melplate SN-2700 deposits have good solderabiliy.

Appearance

Appearance
This SEM images shows surface morphology before and after 100 Ah electrolysis. Deposition crystals is large , flat and dense and didn't change after electrolysis.

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