适用于电子零部件的中性型电解锡镀液

Melplate SN-2680

Chemicals
Electronic
Plating
Tin

Melplate SN-2680

Melplate SN-2680 是一种中性型电解镀锡液,适用于电子零件。

◆特点
1. 由于 pH 值为中性,对陶瓷材料或低熔点玻璃几乎无腐蚀
2. 焊接性良好
3. 几乎不产生锡须
4. 不会生成四价锡(Sn(IV))沉淀物
5. 可控制产品耦合与介质聚集
6. 起泡性低,适用于流通式电镀设备

Chip compornents

Chip compornents
Melplate SN-2680 forms excellent tin deposits, which is necessary to assemble of chip components to PCB.

Assembled MLCC on PCB

Assembled MLCC on PCB
Melplate SN-2680 deposits have good solderabiliy.

Thermal shock test

Thermal shock test
This table shows the result of thermal shock test. Whiskers was generated from conventional pure tin film. And Sn-Pb film also caused small changes. While the film from Melplate SN-2680 was no change. SN-2680 can prevent to generate whiskers.

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