电子零部件的亲水化处理剂
Meldip 1200
Chemicals
Electronic
Hydrophilic treatment
Meldip 1200
Meldip 1200 是一种用于电子零件的亲水化处理液。
◆特点
1. 通过使用 Meldip 1200 进行亲水化处理，可抑制如 0603 或更小尺寸零件在镀镍槽中漂浮，从而有效防止小型电子零件的漏镀现象
2. 即使被带入镀镍槽，Meldip 1200 的成分对镀镍层性能无显著影响，且可通过活性炭处理去除
◆特点
1. 通过使用 Meldip 1200 进行亲水化处理，可抑制如 0603 或更小尺寸零件在镀镍槽中漂浮，从而有效防止小型电子零件的漏镀现象
2. 即使被带入镀镍槽，Meldip 1200 的成分对镀镍层性能无显著影响，且可通过活性炭处理去除
Prevention of floating parts
0402 chip components are put into a nickel plating solution (Watts bath). Whereas 0402 chip components are floating on the surface of the bath in case of no hydrophilizing treatmet using Meldip 1200, there are no floating chip components after hydrophilizing treartmet with Meldip 1200.
Appearance after nickel/tin plating
Surface appearance of chip components electrodes plated with nickel, followed by tin plating (Melplate SN-2680).
Without hydrophilizing treatment, failure deposit of nickel is observed and the following tin plating shows defects. On the other hand, homogheneous plating deposits are achieved by applying hydrophilizing treatment with Meldip 1200.
Without hydrophilizing treatment, failure deposit of nickel is observed and the following tin plating shows defects. On the other hand, homogheneous plating deposits are achieved by applying hydrophilizing treatment with Meldip 1200.