适用于无电镀 Ni/Pd/Au 工艺的自催化无电镀钯溶液

Melplate Pal-6500

TOP ＞ Melplate Pal-6500
Chemicals
Semiconductor
Plating
Palladium

Melplate Pal-6500

Melplate Pal-6500 是一种用于化学 Ni/Pd/Au 工艺的自催化化学镀钯溶液。

◆特点
1.镀层为高纯度钯，不含磷和硼
2.可在镍表面形成较厚的钯镀层
3.镍镀层上的局部腐蚀较少
4.具有良好的可焊性和键合性（适用于 Ni/Pd/Au 镀层）

Surface condition of palladium plating film

Surface condition of palladium plating film
Uniform and dense palladium plating is deposited on the underlying nickel film.

Deposition rate on nickel film (bath temperature 60℃)

Deposition rate on nickel film (bath temperature 60℃)
It has a deposition rate of 0.1 μm/3 min at a bath temperature of 60℃.

Auger spectral analysis of the topmost surface layer　(immersion gold plating) after heat treatment(on Cu substrate)

Auger spectral analysis of the topmost surface layer　(immersion gold plating) after heat treatment(on Cu substrate)
The palladium film deposited by Melplate Pal-6500 effectively suppresses surface diffusion of the underlying metal caused by heat treatment(right figure) and shows good bonding characteristics.

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