非氰型沉金工艺
Melplate AU-7770
Chemicals
Semiconductor
Plating
Gold
Melplate AU-7770
◆特点（金镀层）
1.可获得均匀的金镀层厚度
2.镍镀层上的局部腐蚀较少
3.镀金速率：0.04–0.06 μm/10 分钟
1.可获得均匀的金镀层厚度
2.镍镀层上的局部腐蚀较少
3.镀金速率：0.04–0.06 μm/10 分钟
无氰
Deposition rate on nickel film
Immersion gold plating is deposited while effectively inhibiting localized corrosion of the underlying nickel film.
Deposition rate on palladium film
It has excellent immersion reactivity, even on palladium films, and the deposition thickness increases linearly with plating time.
Inhibits erosion of underlying nickel film
In the case of EN/EP/IG coating composition, the gold immersion deposition process causes preferential dissolution of nickel (galvanic corrosion) due to the difference in electrode potential between nickel and palladium at the electrode edge, which erodes the nickel coating layer (top photo: reference).
Melplate AU-7770 effectively suppresses galvanic corrosion and allows deposition of immersion gold plating without eroding the underlying nickel layer.
Melplate AU-7770 effectively suppresses galvanic corrosion and allows deposition of immersion gold plating without eroding the underlying nickel layer.