Melplate CL-1000S2 shows lower contact angle to copper surface and surface tension compared with conventional acid cleaner. The working solution spreads quickly over copper surface.
Cross sections of BVH and high aspect ratio through hole after electrolytic copper plating.
Excellent wettability of Melplate CL-1000S2 is efefctive to wet the inside of BVHs and high aspect ratio through holes, leading to he supression of air voids. This contributes to form reliable electrolytic copper deposit.