Palladium Catalyst on Copper Substrate for Electroless Nickel.
Melplate Activator 352
Chemicals
PCB
Catalyzing
Palladium
Melplate Activator 352
Melplate Activator 352 is a palladium catalytic process to activate copper substrates selectively for electroless nickel plating.
◆Features
Selectively activates only copper substrates and does not affect glass cloth / epoxy resin.
◆Features
Selectively activates only copper substrates and does not affect glass cloth / epoxy resin.
On sale
Product details
| Products | Melplate Activator 352 |
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| Note | ◆Equipment Tank PE, PP Heater DO NOT use metal tanks and metal heaters. ◆Handling Precousion The operating solution is strong acidity, corrosive and irritant liquid. The oprating solution is includes hydrochloric acid. Exhaust ventilation is recommended to remove mist or vapors during operation. |
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