Electroless Palladium Plating Solution for Semiconductor Electrodes

Melplate Pal-7680 is an auto-catalytic electroless palladium solution for electroless Ni/Pd/Au UBM formation process.
◆Features
1. Thick Pd deposit can be formed on Ni surface.
2. High purity Pd deposit without phosphorus and boron
3. Hardness of Pd deposit will not change after heating
4. Effectively suppresion of localized corrosion of Ni substrate
5. Good solder connectability and bondability.