Palladium Catalyst on Copper Substrate for UBM process.
Melplate Activator 7354
Chemicals
Semiconductor
Catalyzing
Palladium
Melplate Activator 7354
Melplate Activator 7354 is a palladium catalyst to catalyze copper electrodes selectively for electroless nickel plating in UBM process.◆Features1. High selectivity to catalyze copper electrodes2. Suppresing out-growth or skip plating of electroless nickel plating3. Melplate Activator 7354 is controlled by analyzing palladium concentration and pH.
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Product details
| Products | Melplate Activator 7354 |
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| Note | ◆ EquipmentTank PE, PP or tanks coated with these materials. DO NOT use a metallic tank. When palladium deposits on the inner wall of the tank, please make up again after dissolving palladium with hydrochloric acid - hydrogen peroxide etc.. Heater Quartz or PTFE DO NOT use a metallic heater.AgitationAir agitation and continuous filtration are recommended. |
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