2nd Zincate Solution for Aluminum Electrode on Semiconductor Wafer

Melplate FBZ is 2nd zincate solution for electroless UBM forming process.
◆Features
1.Excellent adhesion of electroless nickel deposit is achieved.
2. Dissolution and localized corrosion of aluminum pads are minimized in combination using with Melplate FZ-7350 as the 1st zincate treatment.
3. Unform appearance of electroless nickel deposit is achieved even on large electrodes.