Plating Chemicals for Semiconductor

Process Application Product Name
Seed layer etching Etching
  • A-Process-W

    ・Ammonium type, mild alkaline etchant for copper seed layer.
    ・High purity and high quality for wafer.
    ・Stable etching rate.
    ・Etching rare 5000Å/10sec(Dipping)

  • E-Process-WL

    ・Ammonium type, mild alkaline etchant for copper seed layer.
    ・High purity and high quality for wafer.
    ・Halogen-free, alkali metals-free.
    ・Usable to both dipping and spin etching.
    ・Etching rate 6000Å/60sec(Dipping)

  • Melstrip CU-3930

    ・Acidic copper etchant.
    ・Attack to solder bump is controlled.
    ・Can be used for both dipping and spin etching.
    ・Etching rate 300Å/60sec(Dipping)

  • Melstrip TI-3991

    ・・Potassium hydroxide-hydrogen peroxide type, Alkaline etchant for titanium seed layer.
    ・High purity and high quality for wafer.
    ・Usable to both dipping and spin etching.
    ・No corroding to copper, aluminum, solder and lead-free solder.Etching rate 300Å/60sec(Dipping)

Electroless plating on aluminum pad UBM Process
  • Melceaner SC-7001

    【Degreasing】
    ・Cleaner for aluminum electrode on wafer.
    ・Useable with an ultrasonic cleaning devices.

  • Melplate E-7121

    【Etching】
    ・Few dissolution of aluminum electrode.

  • Melplate Conditioner 7230

    【Conditioning】
    ・Provide flat and smooth zinc plating in combination with Melplate E-7121.

  • Melplate FBZ-7350

    【1st Zincate】
    1st zinc substitution bath for UBM

  • Melplate FBZ

    【2st Zincate】
    2nd zinc substitution bath for UBM

  • Melplate NI-869

    【Electroless Nickel Plating】
    ・Electroless nickel bath for UBM.
    ・Deposition rate: 14-16μm/hr.

  • Melplate AU-7601

    【Immersion Gold Plating】
    ・Cyanide type, acidic immersion gold plating.
    ・Immersion gold plating for UBM.
    ・Provide excellent solder-mounting strength.
    ・Deposition rate: 0.09μm/10min.

  • Melplate AU-7621

    【Immersion Gold Plating】
    ・Cyanide-free, neutral immersion gold plating.
    ・Few corrosion into electroless nickel deposition.
    ・Deposition rate: 0.04-0.06μm/20min.

Page Top